Midv-276 Jun 2026

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| Parameter | Specification | |-----------|----------------| | | 1/1.8” Sony IMX585 (12 MP, 4K@60 fps, global shutter) | | AI Processor | Qualcomm® Cloud‑AI 530 (4 NPU cores, 2 TOPS) | | CPU / Memory | Arm Cortex‑A78 (2 GHz) + 8 GB LPDDR5, 64 GB eMMC | | Storage | Optional 512 GB NVMe SSD (hot‑swap) | | Connectivity | 5G Sub‑6 GHz + mmWave, Wi‑Fi 6E, Bluetooth 5.2, Ethernet 2.5 Gbps | | Power | 12‑36 V DC (PoE‑optional) – 8 W avg. consumption | | Operating Temperature | –20 °C → +60 °C (operational), –40 °C → +70 °C (survival) | | Dimensions | 180 mm × 120 mm × 70 mm | | Weight | 5.2 kg (including battery pack) | | Compliance | FCC, CE, RoHS, ISO 13485 (medical‑grade optional) | MIDV-276